银河yh0076

银河yh0076

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银河yh0076(集团)有限公司
银河yh0076(集团)有限公司
银河yh0076(集团)有限公司

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银河yh0076(集团)有限公司
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晶圆级封装（WLCSP）

概述

银河yh0076创新 SPI NOR Flash 和 SPI NAND Flash 提供 4Mb至 2Gb 的晶圆级封装（WLCSP，Wafer Level Chip Scale Packaging）版本。与传统塑料封装分歧，WLCSP 是一种晶圆级封装，其封装尺寸与裸芯片一样。银河yh0076最小 WLCSP 封装尺寸长度和宽度均可低于 1mm，厚度仅 0.25mm，为紧凑型电路板设计提供了显著的尺寸优势。同时，WLCSP 封装还可改善芯片的散热机能，提高数据传输的不变性。 

从小型化到低功耗，银河yh0076创新通过 WLCSP 封装突破了存储器器件的物理限度，目前已被宽泛利用于可穿戴设备等领域。随着微型化市场需要的发展，WLCSP 封装将持续成为当前及将来重要的封装大局之一。

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    40个了局

    • 电压

      • 1.2V

      • 1.65V~3.6V

      • 1.8V

      • 1.8V VCC, 1.2V VIO

    • 容量

      • 2Mb

      • 4Mb

      • 8Mb

      • 16Mb

      • 32Mb

      • 64Mb

      • 128Mb

      • 256Mb

      • 512Mb

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    Part No
    银河yh0076(集团)有限公司
    状态
    银河yh0076(集团)有限公司
    电压
    银河yh0076(集团)有限公司
    容量
    银河yh0076(集团)有限公司
    温度(工规)
    银河yh0076(集团)有限公司
    频率(MHz)
    银河yh0076(集团)有限公司
    重要个性
    银河yh0076(集团)有限公司
    重要封装
    MP1.8V512Mb-40℃~85℃,-40℃~105℃,-40℃~125℃200(x1 x8),200(x8 DTR)ECC,H/W RESET,WP#,Secured OTPSOP16 300mil,TFBGA24 5x5 ball array,WLCSP (4x6 ball array)
    MP1.2V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,SOP16 300mil,WSON8 6x5mm,WSON8 8x6mm,WLCSP (4-4 ball array)
    MP1.8V VCC, 1.2V VIO256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)H/W RESET,Secured OTP,SuspendTFBGA24 5x5 ball array
    MP1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃200(x1 x8),200(x8 DTR)ECC,H/W RESET,WP#,Secured OTPSOP16 300mil,TFBGA24 5x5 ball array,WLCSP (4x6 ball array)
    MP1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.2V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,USON8 4x4mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array)
    MP1.65V~3.6V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4),66(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,SOP16 300mil,USON8 4x4mm,WSON8 6x5mm,WSON8 8x6mm,TFBGA24 5x5 ball array
    MP1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,FO-USON8 3x3mm,USON8 3x3mm,USON8 4x4mm,WSON8 6x5mm,WSON8 8x6mm,WLCSP (4-4 ball array)
    MP1.2V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
    MP1.65V~3.6V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (3-2-3 ball array)
    MP1.65V~3.6V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4),66(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,FO-USON8 3x2mm,USON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.8V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,FO-USON8 3x2mm,USON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
    MP1.8V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x2 x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,FO-USON8 3x2mm,USON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
    MP1.2V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    MP1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm
    MP1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendUSON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WLCSP (3-2-3 ball array),WLCSP (4-4 ball array)
    MP1.2V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    MP1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WSON8 6x5mm,WLCSP (3-2-3 ball array)
    MP1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x2mm,WLCSP (3-2-3 ball array)
    MP1.2V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,WLCSP (4-4 ball array)
    MP1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,WLCSP (4-4 ball array)
    MP1.65V~3.6V4Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4x6 ball array)
    MP1.65V~3.6V2Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (2x3 ball array)
    UD1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x2 x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    NR1.8V512Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x4),90(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP16 300mil,WSON8 8x6mm,TFBGA24 5x5 ball array,WLCSP (3-2-3 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x4),104(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPWSON8 6x5mm,WSON8 8x6mm,TFBGA24 5x5 ball array,WLCSP (3-2-3 ball array),WLCSP (4-4 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x4 DTR)Default 4I/O,H/W RESET,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)H/W RESET,WP#,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,WSON8 6x5mm,WSON8 8x6mm,WLCSP (4-4 ball array)
    NR1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)Default 4I/O,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)Default 4I/O,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 150mil,VSOP8 208mil,SOP8 150mil,SOP8 208mil,USON8 3x3mm,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,LGA8 3x2mm,WLCSP (4-4 ball array)
    NR1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 150mil,VSOP8 208mil,SOP8 150mil,SOP8 208mil,USON8 3x3mm,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,LGA8 3x2mm,WLCSP (4-4 ball array)
    NR1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 150mil,VSOP8 208mil,SOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x2mm (0.55mm),USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 150mil,VSOP8 208mil,SOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.65V~3.6V4Mb-40℃~85℃,-40℃~105℃,-40℃~125℃100(x1),80(x2)WP#SOP8 150mil,SOP8 208mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4-4 ball array)
    NR1.65V~3.6V2Mb-40℃~85℃,-40℃~105℃,-40℃~125℃100(x1),80(x2)WP#SOP8 150mil,SOP8 208mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4-4 ball array)

    状态注明：：MP：：量产阶段，UD：：开发中，S：：样品阶段，NR：：不推荐

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